With packaging and processing solutions for every industry, educational sessions and networking opportunities, PACK EXPO International is the most comprehensive event in 2022. Come to the show to see the world’s largest showcase of technology, including many product launches, for more than 40 vertical industry sectors, experience the wonder and collaborate with experts.

Qimarox Pack Expo International:

Qimarox will be exhibiting at the PACK EXPO International 2022. 

McCormick Place
2301 S. King Drive
Chicago, Illinois 60616
Exhibits hours:
     October 23-25: 9:00 am – 5:00 pm
     October 26: 9:00 am – 3:00 pm

Produced by PMMI, the Global Leader in Packaging and Processing Technologies 

PACK EXPO International is produced by PMMI, the Association for Packaging and Processing Technologies. PMMI represents more than 950 North American manufacturers and suppliers of equipment, components and materials as well as providers of related equipment and services to the packaging and processing industry. We work to advance a variety of industries by connecting consumer goods companies with manufacturing solutions through the world-class PACK EXPO portfolio of trade shows, leading trade media and a wide range of resources to empower our members. The PACK EXPO trade shows unite the world of packaging and processing to advance the industries they serve. Shows include PACK EXPO International, PACK EXPO Las Vegas, PACK EXPO East, EXPO PACK México and EXPO PACK Guadalajara. 

PMMI Media Group connects manufacturers to the latest solutions, trends and innovations in packaging and processing year-round through brands that include Packaging World, Automation World, Healthcare Packaging, Contract Packaging, ProFood World, Mundo PMMI and OEM.  PMMI Business Drivers assist members in pursuing operational excellence through workforce development initiatives, deliver actionable business intelligence on economic, market and industry trends to support members’ growth strategies and actively connect the supply chain throughout the year.